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                Advanced Packaging Technology

                Cyntec’s technology platform of Electronic Materials Packaging for High Power Circuits, Heat Sink Design Simulation and High Current Metal Lead Frame, allowed us to produce a wide variety of Power Modules.


                Material:
                Embedded substrate lamination material
                Copper lead frame surface treatment
                Ceramic substrate for direct copper bonding
                Encapsulation molding compound

                Design & Simulation:
                Power topology design and optimization
                Multi-physics coupling co-simulation
                Molding cavity design and mold ¬flow simulation

                Process
                Embedded active/passive 3D packaging
                Thin lm photolithography and electroplating
                Encapsulation process (molding, casing, dispensing)
                High density laser drilled via connections
                Au/Al wire bonding interconnection
                High precision die attaching
                High temp soldering SMT and vacuum re¬flow

                Analysis
                Packaging structure (X-ray, De-capsulation)
                Material property (SEM, EDX)
                Semiconductor reliability (EMMI, OBIRCH)
                Adhesion and thermal expansion property analysis
                Thermal conductivity and electrical isolation


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